Job Description

Company Description
Microchip Technology Inc. is a leading provider of embedded control applications. Our product portfolio comprises general purpose and specialized 8-bit, 16-bit, and 32-bit microcontrollers, 32-bit microprocessors, field-programmable gate array (FPGA) products, a broad spectrum of high-performance linear, mixed-signal, power management, thermal management, radio frequency (RF), timing, safety, security, wired connectivity and wireless connectivity devices, as well as serial Electrically Erasable Programmable Read Only Memory (EEPROM), Serial Flash memories, Parallel Flash memories, and serial Static Random Access Memory (SRAM). We also license Flash-IP solutions that are incorporated in a broad range of products.

Job Description
Perform component wire bonding functions in the production of RF transistor packaged devices.  Operates automatic and semi-automatic wire bonders and bond pull tester in performing wire bonding functions

JOB FUNCTIONS:
-    Work on assignments specified by build sheets, requiring attention to detail, high quality and consistent work rate
-    Operates various wire bonding equipment with ability to multi-task by working on several pieces of equipment.
-    Able to work with test technicians and determine optimum wire bonding parameters, including but not limited to adjusting loop heights
-    Must be able to collect, record and discuss Work Order (WO) data gathered during the wire bonding operations.
-    Discuss technical problems encountered with supervisor or technical personnel.

Job Requirements
-    High school degree or equivalent
-    3-4 years of related experience.
-    Strong verbal and written communication skills.
-    Must be able to follow written and verbal instructions.

How To Apply

Please email your resume to thavrith.thao@masshirelowellcc.com for consideration